By Kees Propstra,
VP Marketing & General Manager Quantifi Photonics USA
Following our recent announcement about joining COBO, I am excited to announce our membership of the Optical Internetworking Forum (OIF).
OIF is the leading global industry forum driving the promotion and definition of next generation optical networking solutions. Some of the hot topics that are currently under development are 800G Coherent and 400ZR, Co-Packaging, 112G and 224G Common Electrical Interfaces, and the CMIS management interface.
All of these areas are of critical importance to advance the optical interconnect technologies to the next level and support the ever-growing demand for optical networking bandwidth.
To this end, OIF’s mission aligns perfectly with our goal to support next generation optical interconnect solution developers with test solutions that span the entire product life cycle from R&D, to characterization/validation, all the way to volume manufacturing.
Our test solutions range from laser sources, polarization controllers to optical spectrum analyzers and densely integrated arrays of photodetectors (to name a few examples) and together comprise an ideal test bench for optical sub-assemblies, and photonic integrated circuits (PICs).
Quantifi Photonics has also been a leader in coherent optical analysis for over a decade and is ready to support the evolution of this bandwidth-efficient optical modulation format.
We are looking forward to cooperating with the OIF and all its members in the ecosystem and to help enable the next generation of optical interconnects.
For more information about the important work OIF is doing, visit www.oiforum.com.
Testing Considerations for High-Density Co-Packaged Optical Devices
This white paper provides an overview of the work underway to ensure the interoperability of co-packaged optical devices for a variety of high-bandwidth applications, and discusses how to address the testing challenges coming with this new technology.