Co‑packaged optics (CPO) integrates optical components directly with switch and compute ASICs, enabling dramatic reductions in power consumption and step changes in bandwidth density by shrinking electrical interconnects to millimeter‑scale lengths. Targeted at AI/ML workloads and hyperscale data centers, CPO is positioned to support both scale‑up and scale‑out architectures well beyond the limits of copper.
As AI‑driven bandwidth demands accelerate, the ability to validate complex opto‑electrical devices efficiently and at volume is emerging as a critical bottleneck. Overcoming it is key to enabling widespread deployment of CPO and related technologies.
In this must‑read On‑Topic report from Lightwave Online, Kees Propstra of Quantifi Photonics and Matthew Griffin of Teradyne share practical insights into what it takes to scale silicon photonics and co‑packaged optics testing from the lab into manufacturing workflows.
